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  Foldable Flex and Thinned Silicon Multichip Packaging Technology

  Foldable Flex and Thinned Silicon Multichip Packaging Technology ab 160.49 € als Taschenbuch: Softcover reprint of the original 1st ed. 2003. Aus dem Bereich: Bücher, Taschenbücher, Naturwissenschaft,

  • Shop: hugendubel
  • Price: 160.49 EUR excl. shipping
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  Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module

  Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module ab 427.99 € als gebundene Ausgabe: Ceramic research and development in Japan. Auflage 1993. Aus dem Bereich: Bücher, Wissenschaft, Technik,

  • Shop: hugendubel
  • Price: 427.99 EUR excl. shipping
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  Hybrid Assemblies and Multichip Modules

  Hybrid Assemblies and Multichip Modules: ab 219.99 €

  • Shop: ebook.de
  • Price: 219.99 EUR excl. shipping
• 

  Foldable Flex and Thinned Silicon Multichip Packaging Technology

  Foldable Flex and Thinned Silicon Multichip Packaging Technology: ab 149.99 €

  • Shop: ebook.de
  • Price: 149.99 EUR excl. shipping
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  Conceptual Design of Multichip Modules and Systems

  Conceptual Design of Multichip Modules and Systems: ab 160.49 €

  • Shop: ebook.de
  • Price: 160.49 EUR excl. shipping

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